Hardware support: Intel launches 2nd Gen Optane DIMMs |
- Intel launches 2nd Gen Optane DIMMs
- [Gamers Nexus] ASUS Gimmick: "Performance Enhancement" for i5-10400 on B460, H470
- Mark Papermaster Confirms AMD CDNA GPU This Year
- Architectural advantages of integrated GPUs?
- Will HPC liquid immersion cooling solutions eat away at thermal interface materials under heatsinks?
- (Buildzoid/AHOC)First impressions of Gigabyte's B550 motherboard lineup
- New 5600M GPU on 16" MacBook Pro: Performance Benchmarks
- (Anandtech) Intel Announces D7-P5500 and D7-P5600 Series PCIe 4.0 Enterprise SSDs
- Lawsuit vs. Western Digital wants to end any use of SMR in NAS drives
- Intel Launches Cooper Lake: 3rd Generation Xeon Scalable for 4P/8P Servers
- When was the Broadband Global Area Network (BGAN) actually invented/launched?
Intel launches 2nd Gen Optane DIMMs Posted: 18 Jun 2020 12:13 PM PDT |
[Gamers Nexus] ASUS Gimmick: "Performance Enhancement" for i5-10400 on B460, H470 Posted: 18 Jun 2020 10:52 PM PDT |
Mark Papermaster Confirms AMD CDNA GPU This Year Posted: 18 Jun 2020 03:41 AM PDT |
Architectural advantages of integrated GPUs? Posted: 19 Jun 2020 12:33 AM PDT Is there any sense in which integrated GPUs outperform dedicated GPUs when matched spec for spec? In other words, does the GPU being embedded on the same chip as the CPU provide any advantages in terms of bandwidth/latency that means they can outperform matched GPUs which have to communicate via PCIe? What about in the future? [link] [comments] |
Will HPC liquid immersion cooling solutions eat away at thermal interface materials under heatsinks? Posted: 18 Jun 2020 04:41 PM PDT Whenever I look at images of liquid immersion cooling systems for data centres using 3M Novec or some other low boiling point coolant, I notice that they don't really bother to remove things like heat spreaders and heatsinks. To the point where it's often just off the shelf server hardware or even entire 1U or blade servers being shown submerged. This has always rubbed me the wrong way because I imagine you would eventually get dissolved thermal interface material in the coolant due to both the presence of liquid and the kinetic action of the liquid boiling. Also, if you have a heat spreader or an EMI shield that's not completely sealed, wouldn't liquid get inside of it and leave you with a messy trapped pocket of coolant when you take the board out? Seems like something that would be a problem if you later want to use the board with conventional cooling. I imagine there could also be issues where if the coolant gets inside an EMI shield and starts boiling without sufficient openings to let the gas escape. Are these actual problems that need to be addressed with liquid immersion cooling of compute hardware, or am I over-thinking it? [link] [comments] |
(Buildzoid/AHOC)First impressions of Gigabyte's B550 motherboard lineup Posted: 18 Jun 2020 12:41 PM PDT |
New 5600M GPU on 16" MacBook Pro: Performance Benchmarks Posted: 18 Jun 2020 05:14 PM PDT |
(Anandtech) Intel Announces D7-P5500 and D7-P5600 Series PCIe 4.0 Enterprise SSDs Posted: 18 Jun 2020 07:45 AM PDT |
Lawsuit vs. Western Digital wants to end any use of SMR in NAS drives Posted: 18 Jun 2020 04:35 AM PDT |
Intel Launches Cooper Lake: 3rd Generation Xeon Scalable for 4P/8P Servers Posted: 18 Jun 2020 06:10 AM PDT |
When was the Broadband Global Area Network (BGAN) actually invented/launched? Posted: 19 Jun 2020 01:29 AM PDT Pretty self-explanatory, and really just a matter of satisfying my curiosity as I can't really find any documentation to indicate when BGAN first hit the market. I believe Inmarsat invented it, but when? [link] [comments] |
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