Hardware support: Massive 20GB Intel Data Breach Floods the Internet, Mentions Backdoors |
- Massive 20GB Intel Data Breach Floods the Internet, Mentions Backdoors
- Chinese Hackers Have Pillaged Taiwan's Semiconductor Industry
- The Next Step in SSD Evolution: NVMe Zoned Namespaces Explained
- Intel Grand Ridge features up to 24 Atom cores, supports DDR5 and PCIe 4.0
- A spokesperson for Intel denied the corporation had been hacked, though, and said the information was likely taken from its Resource and Design Center
- China to give 10-year tax break to local chip makers using 28 nanometre node
- How does the bidding for wafers work?
- Compute Express Link: Memory Challenges and CXL Solutions
- Samsung Narrows Gaps Fast With Image Sensor Market Leader Sony
- EKWB Introduces Flow Indicators
- How feasible is it to learn "on the spot" for phone repairs with low repairability scores?
| Massive 20GB Intel Data Breach Floods the Internet, Mentions Backdoors Posted: 06 Aug 2020 11:26 AM PDT |
| Chinese Hackers Have Pillaged Taiwan's Semiconductor Industry Posted: 06 Aug 2020 07:00 PM PDT |
| The Next Step in SSD Evolution: NVMe Zoned Namespaces Explained Posted: 06 Aug 2020 10:10 AM PDT |
| Intel Grand Ridge features up to 24 Atom cores, supports DDR5 and PCIe 4.0 Posted: 06 Aug 2020 10:01 PM PDT |
| Posted: 06 Aug 2020 01:23 PM PDT |
| China to give 10-year tax break to local chip makers using 28 nanometre node Posted: 06 Aug 2020 05:59 AM PDT |
| How does the bidding for wafers work? Posted: 06 Aug 2020 09:10 AM PDT AFAIK when there are several fabs below capacity, the customers choosing between them try to get the most transistors per dollar, with performance also factoring in. Does e.g. AMD write to TSMC like: "if you won't provide x wafers for y price we'll switch to Samsung", and then they haggle? But what about when the whole capacity of the desired fabs is already full from orders? Do the fabbing contracts include clauses that allow the fab to buy back capacity from their customers, for the purpose of reselling it for higher price? E.g. if Company A buys capacity from TSMC before the full capacity is reached for 1000 dollars per wafer, but after the capacity has been filled Company B wants to get wafers at 2000 dollars, so TSMC would like to be able to reallocate the wafers, while giving a >1000 dollar compensation to Company A. What methods (of game theory etc.) would TSMC use to maximize profits without breaking any contracts? How far in advance is the capacity bought? I'd assume at least 2 years before the product's release, when the RTL is being finalized, e.g. Nvidia probably bought TSMC 7nm capacity back in 2018. [link] [comments] |
| Compute Express Link: Memory Challenges and CXL Solutions Posted: 07 Aug 2020 12:17 AM PDT This looks Interesting enough to Warrant a thread. The talk itself: Some disscussion and slides: CXL is essentially a PCIe 5.0 based middle-layer between the CPU and RAM (and stuff like Optane memory) allowing much more flexibility and bandwidth. It's memory version agnostic (DDR 3/4/5) and plays nicely with persistent (e.g. Optane DIMM) and non-persitent memory in a unified system. This slide explains it quite well. What Really caught my attention was slide 17. I always considered CXL to be more of a server-related technology, but this definitely has potential on the client side:
Now since it's based on PCIe 5, it will take it's time before we see it on desktop. But it might happen in AM5 timeframe (like PCIe 4.0 happend on AM4) [link] [comments] |
| Samsung Narrows Gaps Fast With Image Sensor Market Leader Sony Posted: 06 Aug 2020 10:16 AM PDT |
| EKWB Introduces Flow Indicators Posted: 06 Aug 2020 11:24 PM PDT |
| How feasible is it to learn "on the spot" for phone repairs with low repairability scores? Posted: 06 Aug 2020 01:47 PM PDT So I'm a compsci student who's always had a liking for breaking things apart, figuring them out, attempting mostly to put them back together. This was always limited to things I can unmount with screwdrivers, because I lack any other equipment save some basic plastic tools. I've done projects with the rpi and been in element14 for a bit if that provides any further info. The most "complex thing" I've done is swap a phone battery out of an iPhone, that got a '7 repairability score'. I just got a Samsung S20, and I know the latest Samsungs are particularly difficult to tear apart because of the curved screen + a bunch of sensors/other things put in tightly. Its repairability score is a 3. As I just started paying $9/month for accidental damage insurance, I was wondering how realistic it would be to just save that money, and if ever I need to replace the screen I buy the required tools (I've always wanted a heat gun to get into cable making anyway) to do it myself. What I was wondering is if I could find ways to "build up" to that level of complexity. To be quite honest, it'd be cool to learn more about hardware. So yeah. Any suggestions for, for instance, raspberry pi projects to get me going? :) [link] [comments] |
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