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    Home Unlabelled Hardware support: Samsung Develops DDR5 Memory Modules With 512 GB Capacity – Based on High-K Metal Gate Process & Up To 7200 Mb/s

    Hardware support: Samsung Develops DDR5 Memory Modules With 512 GB Capacity – Based on High-K Metal Gate Process & Up To 7200 Mb/s

    March 25, 2021

    Hardware support: Samsung Develops DDR5 Memory Modules With 512 GB Capacity – Based on High-K Metal Gate Process & Up To 7200 Mb/s

    Samsung Develops DDR5 Memory Modules With 512 GB Capacity – Based on High-K Metal Gate Process & Up To 7200 Mb/s

    Posted: 25 Mar 2021 12:01 AM PDT

    MSI warns its AMD and Nvidia graphics cards will see a price rise

    Posted: 24 Mar 2021 08:32 AM PDT

    TSMC: How a Taiwanese chipmaker became a linchpin of the global economy

    Posted: 24 Mar 2021 02:46 PM PDT

    Intel claims to have shipped 30 million Tiger Lake CPUs. How many 10nm wafers per month is that?

    Posted: 24 Mar 2021 08:03 PM PDT

    Many have wondered about the state of Intel's 10nm production capacity. The info about TGL production numbers might provide a clue. A TGL die is 13.49 x 10.70 mm, which according to https://caly-technologies.com/die-yield-calculator gives exactly 400 dies per wafer. So if the yields were perfect then 30 million TGLs would need 75000 wafers. If in the calculator we set the defect density to 0.2 per cm2 (for context TSMC's N7 and N5 have it under 0.1) we get 302 fully working dies per wafer. However fully working dies are only needed for i7, while lower-tier models can have cores, cache and GPU EUs disabled.

    Still assuming 300 usable dies per wafer for the subtotal of 100K wafers, we then have to add the products other than Tiger Lake, like Tremont, Snow Ridge, Xe-LP and FPGAs. Those are hard to estimate (Intel's ERs aren't very detailed), but the Tiger Lake is in a much larger market segment, so I guess it's larger than other 10nm products combined. We do know that Intel shipped only 115K Ice Lake Xeons till 9 of March, which according to Ian Cutress' estimate would need only around 1620 wafers. It would seem Intel has fabbed 120K-150K 10nm wafers in 8 months since Tiger Lake entered mass production, or around 15K-20K per month. Does that sound about right for the 3 big 10nm fabs Intel has? How's the ramp-up going?

    submitted by /u/ForgotToLogIn
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    What Goes Wrong In Advanced Packages [Semiconductor Engineering]

    Posted: 24 Mar 2021 08:34 PM PDT

    VideoCardz: "Next-Gen Nintendo Switch rumored to feature NVIDIA 'Ada Lovelace' GPU architecture"

    Posted: 24 Mar 2021 03:40 AM PDT

    ASUS Hints At Increased Prices With Ongoing GeForce RTX 30 Series Shortage

    Posted: 24 Mar 2021 12:36 PM PDT

    [Gamers Nexus] Intel's Z590 Motherboard Problem: i7-11700K Power & Thermals Explained

    Posted: 24 Mar 2021 01:20 PM PDT

    Intel to build ARM chips for other companies as part of its new business strategy - 9to5Mac

    Posted: 25 Mar 2021 12:36 AM PDT

    What is the difference between DDR5 ECC and real ECC?

    Posted: 24 Mar 2021 08:24 AM PDT

    Every time DDR5 ECC is brought up here, someone will say it is not real ECC but they offer little to no explanation. Can someone explain their difference? Thanks!

    submitted by /u/netok
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    AMD RX590 (Sapphire Nitro+) in 2021 on current driver version

    Posted: 25 Mar 2021 01:27 AM PDT

    Huawei plans to start charging patent fees to Samsung, Apple for each 5G phone sold

    Posted: 24 Mar 2021 10:34 PM PDT

    NVIDIA (Quadro) RTX A4000 and RTX A5000 Ampere workstation graphics cards spotted

    Posted: 24 Mar 2021 12:26 PM PDT

    [ VideoCardz] - NVIDIA GeForce RTX 3080 Ti now rumored to launch in May

    Posted: 24 Mar 2021 08:28 AM PDT

    EuroHPC Lays Out a Roadmap for (Almost) All of Its New Systems

    Posted: 24 Mar 2021 11:24 AM PDT

    [ RTINGS ] ASUS TUF Gaming VG34VQL1B Review

    Posted: 24 Mar 2021 07:36 AM PDT
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