Hardware support: AMD Threadripper 3960/3970X Review megathread |
- AMD Threadripper 3960/3970X Review megathread
- Intel Cascade Lake X CPU Review Megathread
- U.S.-based chip-tech group moving to Switzerland over trade curb fears
- Analysis of Our Q4 2019 HEDT Processor Reviews - ServeTheHome
- Intel Releases SSD 665p: Second-Gen QLC
- What is the purpose of the metal frame around many bare-die chip packages?
- How does Intel's "Foveros" chip stacking technology work and what are its benefits and drawbacks.
- NVIDIA Tesla V100S Boasts Big Performance Gains at Same Power
- DRAM Scaling Challenges Grow
- Samsung M5 Core Details Show Up
- AMD unveils the magic behind its Ryzen Threadripper 3rd Generation CPUs - It's all about equal access
- Google addresses complaints of sub-4K image quality on Stadia
- First Look: All the AMD TRX40 Motherboards for Third-Gen Threadripper
- Intel and MediaTek Announce Partnership To Bring 5G Modems to PCs
- You are intel CEO. What are you going to do?
- Tiger Lake desktop CPUIDs and model numbers added to the Linux kernel
- Rambling about the Z390 DARK, Gene, Master, PhantomGaming ITX, Pro, -A a...
| AMD Threadripper 3960/3970X Review megathread Posted: 25 Nov 2019 08:31 AM PST Videocardz Review Roundup list Written Reviews: Puget Systems - Individual benchmarks, link to menu. Other Laguages in written: Coolaler (In Traditional Chinese) XFastest (In Traditional Chinese) Videos: (Will be updated, please post below if any is missed) [link] [comments] |
| Intel Cascade Lake X CPU Review Megathread Posted: 25 Nov 2019 08:39 AM PST Apologies for the late megathread - most of us (the moderators) are busy. The removed thread remained unlocked if you want to continue to discuss in those threads. Edit: This thread will not be separated into written/video review due to the limited amount of reviews available compare to TR3 - please refer to Videocardz's list for details Videocardz Review Roundup list (will be continuously updated, please post below if I missed any) [link] [comments] |
| U.S.-based chip-tech group moving to Switzerland over trade curb fears Posted: 25 Nov 2019 09:01 PM PST |
| Analysis of Our Q4 2019 HEDT Processor Reviews - ServeTheHome Posted: 25 Nov 2019 07:34 PM PST |
| Intel Releases SSD 665p: Second-Gen QLC Posted: 25 Nov 2019 12:08 PM PST |
| What is the purpose of the metal frame around many bare-die chip packages? Posted: 25 Nov 2019 10:54 PM PST I've noticed for quite a while that with many microprocessors where the bare silicon die is exposed, there is often a metal frame around the package. Notable examples include some Intel Core M SKUs, most graphics card GPUs, the CPU on the Xbox One X, AMD's embedded EPYC processors, and the Intel Lakefield concept apparently has two of these frames. It seems to be a very popular design element of bare-die chips. It honestly looks like the base of an integrated heat spreader, but it doesn't cover the die. What is this frame for? Is it to prevent the heat sink from applying too much pressure to the chip? Some kind of structural rigidity? Some electrical function? [link] [comments] |
| How does Intel's "Foveros" chip stacking technology work and what are its benefits and drawbacks. Posted: 25 Nov 2019 05:30 PM PST How does Intel's new "Foveros" chip stacking technology work, and what are the advantages and disadvantages, and use cases? Is it just space savings they're after? Is it better or worse than 2d chiplets in terms of cost or yield, efficiency or performance? It also looks from the press releases that they plan on only having two layers (not including the integrated DRAM), with the bottom serving as both the interposer and space for cache and lower power chip components. You'd think that having a combined interposer and auxiliary chip IPs the size of the package itself wouldn't be great for yields or flexibility, especially if they want larger desktop, workstation and server/enterprise chips with this technology, so why not have two stacks of chiplets, one on top (for the CPUs, GPUs and any high power ASICs) and one interfacing with the package (with separate chiplets for cache and auxiliary processing) with an interposer in between? That way only the interposer is the size of the package, which I assume is much easier to manufacture right than a processor. [link] [comments] |
| NVIDIA Tesla V100S Boasts Big Performance Gains at Same Power Posted: 25 Nov 2019 07:35 PM PST |
| Posted: 25 Nov 2019 08:12 PM PST |
| Samsung M5 Core Details Show Up Posted: 25 Nov 2019 07:40 PM PST |
| Posted: 25 Nov 2019 06:06 AM PST |
| Google addresses complaints of sub-4K image quality on Stadia Posted: 25 Nov 2019 04:29 PM PST |
| First Look: All the AMD TRX40 Motherboards for Third-Gen Threadripper Posted: 25 Nov 2019 06:40 AM PST |
| Intel and MediaTek Announce Partnership To Bring 5G Modems to PCs Posted: 25 Nov 2019 10:57 AM PST |
| You are intel CEO. What are you going to do? Posted: 26 Nov 2019 01:26 AM PST Hi there, I am interested in how Intel is going to sail this storm. If you were the boss in Intel, what things are you going to do now? [link] [comments] |
| Tiger Lake desktop CPUIDs and model numbers added to the Linux kernel Posted: 25 Nov 2019 06:13 AM PST https://lkml.org/lkml/2019/9/6/30
Ice Lake desktop first had CPUIDs and model numbers added in June and then more were added in October: [link] [comments] |
| Rambling about the Z390 DARK, Gene, Master, PhantomGaming ITX, Pro, -A a... Posted: 25 Nov 2019 05:18 PM PST |
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