• Breaking News

    Monday, April 25, 2022

    Home Unlabelled Hardware support: AMD preparing EXPO (EXtended Profiles for Overclocking) for Ryzen 7000 DDR5 memory overclocking - VideoCardz.com

    Hardware support: AMD preparing EXPO (EXtended Profiles for Overclocking) for Ryzen 7000 DDR5 memory overclocking - VideoCardz.com

    April 25, 2022

    Hardware support: AMD preparing EXPO (EXtended Profiles for Overclocking) for Ryzen 7000 DDR5 memory overclocking - VideoCardz.com

    AMD preparing EXPO (EXtended Profiles for Overclocking) for Ryzen 7000 DDR5 memory overclocking - VideoCardz.com

    Posted: 25 Apr 2022 01:12 AM PDT

    AyaNeo OLED gaming console to feature 12W AMD Ryzen 5000U APU, no RDNA2 graphics - VideoCardz.com

    Posted: 25 Apr 2022 12:40 AM PDT

    Semiconductor Engineering: "Paving The Way To Chiplets"

    Posted: 25 Apr 2022 08:43 AM PDT

    "Tower Shareholders Approve Intel Merger at Extraordinary General Meeting"

    Posted: 25 Apr 2022 08:46 AM PDT

    [VideoCardz.com] Intel Arc Alchemist lineup rumored to include 7 desktop models

    Posted: 24 Apr 2022 11:34 PM PDT

    Intel Data Center GPU AV1 Demo

    Posted: 25 Apr 2022 03:42 AM PDT

    DIY a Gaming Handheld With an Old Smartphone! (geekerwan)

    Posted: 25 Apr 2022 08:37 AM PDT

    AMD Ryzen 7 5800X3D versus all the others - workstation test with some shadows and a bit less light | igor'sLAB

    Posted: 24 Apr 2022 11:39 PM PDT

    What Packaging is Used for Large Dies?

    Posted: 24 Apr 2022 10:13 PM PDT

    I've heard that for large high performance dies, due to temperature mismatch and the resulting thermal expansion, it's not possible to directly flip chip the die directly to PCB, BGA style.

    How is packaging done on large high performance, large die?

    submitted by /u/itisyeetime
    [link] [comments]
    Read more
    at

    No comments:

    Post a Comment