• Breaking News

    Saturday, February 29, 2020

    Home Unlabelled Hardware support: [Gamers Nexus] X-Ray Analysis: Nasty Enermax Slime in New Threadripper Liqtech II Coolers

    Hardware support: [Gamers Nexus] X-Ray Analysis: Nasty Enermax Slime in New Threadripper Liqtech II Coolers

    February 29, 2020

    Hardware support: [Gamers Nexus] X-Ray Analysis: Nasty Enermax Slime in New Threadripper Liqtech II Coolers

    [Gamers Nexus] X-Ray Analysis: Nasty Enermax Slime in New Threadripper Liqtech II Coolers

    Posted: 28 Feb 2020 10:49 PM PST

    Nvidia GPU with 7552 Cuda cores appears on Geekbench

    Posted: 28 Feb 2020 10:24 AM PST

    AiB GPU Market Share Q4'19: AMD 31.1% vs. nVidia 68.9%

    Posted: 29 Feb 2020 02:40 AM PST

    AiB GPUs Q4'18 Q1'19 Q2'19 Q3'19 Q4'19
    AMD 18.8% 22.7% 32.1% 27.1% 31.1%
    nVidia 81.2% 77.3% 67.9% 72.9% 68.9%

     

    all GPUs Q4'18 Q1'19 Q2'19 Q3'19 Q4'19
    AMD 13% 15% 16% 16% 19%
    Intel 72% 69% 65% 65% 63%
    nVidia 15% 16% 19% 19% 18%

     

    AiB = add-in board = desktop graphics card
    all GPUs = all PC GPUs, including mobile GPUs and integrated GPUs (in AMD's and Intel's processors)

     

    as a diagram: Add-in Board GPU Market Share 2002 - Q4'19

     

    Sources: Jon Peddie Research #1, Jon Peddie Research #2, 3DCenter.org

    submitted by /u/Voodoo2-SLi
    [link] [comments]

    Raspberry Pi 4 Linux computer gets twice the RAM and USB-C power fix

    Posted: 28 Feb 2020 04:51 PM PST

    BIOSTAR does a throwback with H61 series motherboard reboot

    Posted: 28 Feb 2020 07:28 AM PST

    Chiplet Momentum Rising

    Posted: 28 Feb 2020 11:40 AM PST

    [IEEE Spectrum] 96-Core CEA-Leti Processor Made of Chiplets

    Posted: 28 Feb 2020 11:58 AM PST

    When would an exposed die package be most at risk of chipping and how do you mitigate it?

    Posted: 28 Feb 2020 03:54 PM PST

    If you have a semiconductor package that is just a bare die on a substrate attached to a heat sink, what conditions would contribute to it being at risk of chipping or cracking?

    I heard that the most important factor is if you have a tall chip (maybe even a multi-layered chip) and a heat sink with a wide and flat bottom plate (for example if it's also designed to make contact with things around the chip), it's really easy to chip the die during installation or operation if the heat sink rocks of tilts. To what extent is this true and what are some other factors? What are some mitigations for these?

    submitted by /u/AgreeableLandscape3
    [link] [comments]

    Recording Video In The Era Of CRTs: The Video Camera Tube

    Posted: 28 Feb 2020 05:51 AM PST

    The Team Group MP33 M.2 2280 1TB PCIe SSD Review

    Posted: 28 Feb 2020 07:03 AM PST

    [Actually Hardcore Overclocking] G.skill F4-3466C16D-16GTZR overclocked to 3733MHz on ASUS X570i Strix with 3700X // Hynix CJR

    Posted: 28 Feb 2020 05:30 PM PST

    John Peddie - 4 companies will be releasing dGPUs in 2020

    Posted: 28 Feb 2020 12:49 PM PST
    Read more
    at

    No comments:

    Post a Comment