• Breaking News

    Saturday, August 15, 2020

    Hardware support: Micron confirms NVIDIA GeForce RTX 3090 gets 21Gbps GDDR6X memory - VideoCardz.com

    Hardware support: Micron confirms NVIDIA GeForce RTX 3090 gets 21Gbps GDDR6X memory - VideoCardz.com


    Micron confirms NVIDIA GeForce RTX 3090 gets 21Gbps GDDR6X memory - VideoCardz.com

    Posted: 14 Aug 2020 04:45 AM PDT

    NVIDIA GeForce RTX 3090 features twelve GDDR6X memory modules

    Posted: 14 Aug 2020 11:14 AM PDT

    Intel announces Avengers-themed CPU packaging

    Posted: 14 Aug 2020 09:08 PM PDT

    Motherboard Makers: "Intel Really Screwed Up" on Timing RTX 3080 Launch

    Posted: 15 Aug 2020 12:39 AM PDT

    Sony files patent for potential liquid metal use in a console

    Posted: 14 Aug 2020 10:25 AM PDT

    (technical document about gddr6x) Doubling I/O Performance with PAM4

    Posted: 14 Aug 2020 08:00 AM PDT

    Part of why NVIDIA is so big these days: 0 to Supercomputer NVIDIA Selene Deployment (STH)

    Posted: 14 Aug 2020 02:24 PM PDT

    Crucial P5 1 TB M.2 NVMe SSD Review

    Posted: 14 Aug 2020 12:23 PM PDT

    Long Awaited Left-Handed Razer Naga Finally Released

    Posted: 14 Aug 2020 06:31 AM PDT

    More Information on 2xFP32 Rumors for Ampere

    Posted: 14 Aug 2020 07:45 AM PDT

    [Evening Standard] US chipmaker Nvidia closing in on deal to buy Arm

    Posted: 15 Aug 2020 01:22 AM PDT

    [hardware Unboxed] - Ryzen 4000 vs Intel 10th-gen Same Laptop Gaming Battle feat. XMG Core 15

    Posted: 14 Aug 2020 04:34 AM PDT

    Why was USB 3 renamed twice?

    Posted: 14 Aug 2020 07:06 AM PDT

    I am always confused which name stands for which standard. When I look it up I always find people saying they are annoyed by the renaming but I never found a real reason why they did this.

    If you are wondering which changes I mean: I am talking about USB 3 being renamed to USB 3.1 Gen. 1 and afterwards to USB 3.2 Gen. 1. Same goes for the first USB 3.1, which later was USB 3.1 Gen. 2 and now USB 3.2 Gen. 2.

    Btw the latest standard is called "USB 3.2 2x2" which I think is like the worst name they could have chosen.

    submitted by /u/Hornomatus
    [link] [comments]

    (Anandtech) Samsung Announces "X-Cube" 3D TSV SRAM-Logic Die Stacking Technology

    Posted: 14 Aug 2020 07:15 AM PDT

    (Buildzoid/AHOC)Rambling about Thermaltake's Floe RC RAM CPU liquid coolers & RAM cooling

    Posted: 14 Aug 2020 09:04 PM PDT

    Luxshare grows into China's iPhone champion with help from Apple *Subscribtion only article, added details in comments for non-subscibers !

    Posted: 14 Aug 2020 02:20 AM PDT

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